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Mechanical Thermal Engineer

https://www.hpe.com/ Logo

Hewlett Packard Enterprise

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Location:
United States, Roseville

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Category:
-

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Contract Type:
Not provided

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Salary:

101900.00 - 234500.00 USD / Year

Job Description:

This is an office-based role, the selected candidate will work from HPE office in Roseville, CA. The role involves thermal simulation, heatsink design, in-lab testing and data analysis to ensure product viability, quality, and long term reliability. The candidate will design and test engineering solutions for thermal and mechanical hardware, electronics enclosures, and production tooling. They will also develop and implement parameters and test plans for new and existing designs, including validation of thermal performance, reliability, system power measurements, acoustics, tolerances, form/fit/function, shock and vibration, electromagnetic interference, and safety.

Job Responsibility:

  • Thermal simulation, heatsink design, in-lab testing and data analysis to ensure product viability, quality, and long term reliability
  • Designs and tests engineering solutions for thermal and mechanical hardware, electronics enclosures, and production tooling
  • Develops and implements parameters and test plans for new and existing designs, including validation of thermal performance, reliability, system power measurements, acoustics, tolerances, form/fit/function, shock and vibration, electromagnetic interference, and safety
  • Supports project team of other mechanical and thermal hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for complex products
  • Collaborates and communicates with hardware and software partners and stakeholders regarding design status, project progress, and issue resolution
  • Represents the mechanical/thermal team for all phases of larger and more-complex development projects
  • Provides guidance and mentoring to less-experienced staff members

Requirements:

  • Bachelor's or Master's degree in Mechanical Engineering or a related field
  • 10+ years of experience in thermal design and electronic packaging
  • Understanding and experience in thermal design and electronics packaging, particularly high-density, high-power systems such as those in data center compute and networking applications
  • Demonstrated technical leadership skills, effective communication, independence, and familiarity with managing design tradeoffs in a system design environment
  • Experience in thermal testing, including the use of DAQs and thermocouples, thermal chambers, metered flow benches, and familiarity with scripting languages such as Python
  • Strong analytical and problem-solving skills as well as the use of CFD software (FloTherm, IcePak, Fluent) and thermal mockups to validate thermal solutions
  • Design of heatsinks, sheet metal, and plastic parts, and associated production tooling and processes
  • Experience working with vendors to develop and deliver solutions
  • Understanding and experience in system thermal control, including fan control
  • Using Flotherm, Creo/Parametric, SolidWorks, or other 3D CAD software as a mechanical design tool
  • Ability to effectively communicate product architectures, design proposals, and negotiate options at various levels of management

Nice to have:

Accountability, Action Planning, Active Learning, Active Listening, Agile Methodology, Agile Scrum Development, Analytical Thinking, Bias, Coaching, Creativity, Critical Thinking, Cross-Functional Teamwork, Data Analysis Management, Data Collection Management, Data Controls, Design, Design Thinking, Empathy, Follow-Through, Group Problem Solving, Growth Mindset, Intellectual Curiosity, Long Term Planning, Managing Ambiguity

What we offer:
  • Health & Wellbeing
  • Personal & Professional Development
  • Unconditional Inclusion

Additional Information:

Job Posted:
June 07, 2025

Employment Type:
Fulltime
Work Type:
Hybrid work
Job Link Share:
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