Mechanical/Hardware Engineer I Graduate, Hewlett Packard Enterprise

Hewlett Packard Enterprise

Location:
United States, Chippewa Falls

Category:
IT - Software Development

Contract Type:
Employment contract

Salary:

53600.00 - 122800.00 USD / Year

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Job Description:

Mechanical/Hardware Engineer I Graduate position at Hewlett Packard Enterprise designing engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling.

Job Responsibility:

Designs portions of engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling
Implements established test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics
Develops understanding of and relationship with internal and outsourced development partners on mechanical and thermal design and development
Participates as a member of project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions

Requirements:

Bachelor's or Master's degree in Mechanical Engineering
Typically 0-2 years experience
Experience or understanding of ProEngineer or other 3D CAD software as a mechanical design tool
Good analytical and problem solving skills
Understanding of design for sheet metal and plastic parts and associated production tooling and processes
Understanding of thermal properties of materials and heat transfer
Good written and verbal communication skills
mastery in English and local language

What we offer:

Health & Wellbeing benefits
Personal & Professional Development programs
Unconditional Inclusion workplace

Additional Information:

Job Posted:
August 22, 2025

Employment Type:

Fulltime

Work Type:

On-site work

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Mechanical/Hardware Engineer I Graduate