Mechanical Engineering Intern, Hewlett Packard Enterprise

Hewlett Packard Enterprise

Location:
United States, Chippewa Falls

Category:
IT - Software Development

Contract Type:
Employment contract

Salary:

35.00 - 40.25 USD / Hour

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Job Description:

Responsible for supporting mechanically, thermally, and acoustically in support of server designs. Involves system-level design of mechanicals and compliance focusing on mechanical designs. Involves daily use of 3D Modeling software, Thermal Design & Management software, materials science, chemistry, as well as fluid flow analysis and system-level control logic. The intern will be part of a Program Team that includes electrical, software, marketing, and managers responsible for getting a server designed and delivered to HPE customers. Located at HPE's Wisconsin campus in Chippewa Falls.

Job Responsibility:

Contribute to technical projects by participating in design, analysis, testing, and implementation activities related to assigned technical projects
Apply academic knowledge to real-world engineering challenges, developing essential skills and understanding industry best practices
Participate in team activities by attending team meetings, learning about project methodologies, and collaborate effectively with colleagues
Actively engage in learning about new technologies and methodologies relevant to work
Fulfill tasks and responsibilities assigned by a supervisor in a timely and efficient manner
Participate in periodic reviews to share updates and incorporate feedback on assigned projects/initiatives

Requirements:

Working toward degree in Mechanical Engineering or equivalent
Understanding of microprocessor architecture and thermal profiles
Proficient comprehension in 3D Modeling software
Computer literacy - spreadsheet, word processing, understanding of basic file structures, network, and web navigation familiarity
Ability to establish clear goals and formulate plans to achieve them
Works independently and as part of a team
Excited about technology and has the desire to learn new tasks and technologies
Fundamental understanding of PC architecture and components
Read and reproduce issues from a written description, work backward to isolate and diagnose problems
Excellent written and verbal communication skills - communicating with various people in this R&D environment
Able to work with basic electronics testing tools including soldering, multi-meters
Any thermal/environmental testing experience is a plus since electronic boards and components will be subjected to thermal testing in ovens/chambers to determine performance under these various temperature conditions
Must be able to work with various hand tools like drill presses, band saws, mills, lathes, etc., to modify computer chassis and build wind breaks, funnels, etc., that will direct airflow in various directions throughout the computer

Nice to have:

Any thermal/environmental testing experience is a plus
Must be excited about technology
Experience with wind break and airflow direction modifications

What we offer:

Health & Wellbeing suite of benefits
Personal & Professional Development programs
Unconditional inclusion in workplace

Additional Information:

Job Posted:
November 30, 2025

Employment Type:

Fulltime

Work Type:

On-site work

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Mechanical Engineering Intern