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Mechanical Engineer Intern position at Hewlett Packard Enterprise's Compute division, working on the Synergy and In-Memory Compute hardware engineering team. The role involves mechanical and thermal design of servers, using CAD for system level design, and working with materials science and mechanical design skills.
Job Responsibility:
Responsible for developing and delivering cost effective mechanical and cooling designs
Working with system level design of mechanicals using CAD to design sheet metal and plastics
Working with thermal designs using high performance fans, heatsinks, and baffles
Daily use of materials science and mechanical design skills
Being part of a program team that includes electrical, software, marketing and managers
Requirements:
Currently working toward a bachelor’s degree in mechanical engineering (BSME)
Good problem-solving skills
Ability to understand and interpret Computational Fluid Dynamics reports
Understanding of microprocessor architecture and thermal profiles
Computer literacy - spreadsheet, word processing, understanding of basic file structures, network, and web navigation familiarity
Fundamental understanding of PC architecture and components
Must be comfortable with OS/software installs and running and recording data in files
Able to work with basic electronics testing tools including soldering, multi-meters
Must be able to work with various tools like drill presses, band saws, mills, lathes, etc. to modify computer chassis
Nice to have:
Any thermal/environmental testing experience
Experience with tools like drill presses, band saws, mills, lathes from professional setting or home use
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