Manufacturing Engineer

• Support assigned NPI products as a key DFM engineer responsible for PCBA manufacturability including compliance with EMS or other DFM guidelines in areas including SMT, BGA repair processes, wave solder, press fit, component package and new part qualification
• Work with signal integrity teams and PCB suppliers to develop PC board stack-ups
• Performs DFM reviews of new designs in execution with responsibility for resolving PCBA and PCB manufacturability issues
• Attends program teams, EMS partner reviews, DFM council or other meetings related to PCBA/PCB DFM issues
• You should have solid understanding of interconnect, SMT, solder process/materials and new component packaging as it applies to PCBA manufacturing to improve designs for high yields and ease of assembly
• In coordination with factory teams, monitors or develops DOE’s to identify and confirm process parameters related to PCBA
• Manage/lead specific mfg. technology related projects as the need arises in collaboration with outside suppliers and internal subject matter authorities
• Provide mentorship/support to quality and sustaining mfg. engineering teams for critical quality or manufacturing problems on assigned products
• Initial setup of both new and existing product BOM structures
• setup of new products for operation in the Juniper test environment
• Design and implementation of production test cells at outsourced manufacturing partners
• Training and NPI ramp-up support at outsource partner sites
• Product BOM structuring and submission of ECO’s for top level assemblies
• Defining high level test process flows for use by both contract manufacturing and ODM partners
• Driving manufacturing facilities test cell setup and line layout
• Developing capacity models and taking appropriate action to assure proper capacity is online at product release
• Conducting line balancing and time studies for various process steps
• Defining and procuring production test cell and product handling equipment
• Defining new product test steps to assure efficiency in mass production
• Providing usability feedback for factory test process operation including ease-of-use testing, repeatability testing, configuration testing, shippable software load validation, and general operation within the Juniper test environment
• Conducting system-level test operation training at partner manufacturing sites
• Driving correction of quality issues related to product and process
• Driving cycle time reductions primarily by working with test developers during NPI phase to optimize test time versus test coverage
• Working with packaging engineering to implement packaging solutions for all products
• Establishing serialization and other product labeling standards
• Creating product bundles and special configurations required by business teams
• Defining and validating new product configurations allowed by the product configurator

• B.Tech/B.E. or higher degree with at least 7-10 years of electronics manufacturing experience
• Consistent track record in supporting new product development teams as an NPI mfg. engineer with responsibility for complex PCBA and/or PCB manufacturability
• Requires confirmed knowledge of interconnect and electronic assembly applications and technologies including soldering, press fit, and rework with knowledge of IPC-A-610.
• Understanding of complex failure mechanisms in PCBA process and or PCB fabrication and knowledge of standard failure analysis techniques (SEM, EDX, X-section, Die and Pry, CSAM)
• Proven track record to work independently in a multifaceted growth environment
• Language skills: English (proficient – verbal and written)
• Excellent problem-solving/analytical skills with strong interest in collaboration
• Practical skills including experience improving business processes
• Test experience is a plus
• Candidates with both OEM PCBA NPI development and EMS partner factory experience preferred
• Prefer good/ understanding of PCB CAD design and fabrication processes including stack-up analysis and development and understanding of PCB fabrication challenges encountered with complex PCBA’s associated with aspect ratios, padstacks, back-drills, and POFV technologies
• Travel requirements may be required by generally no more than 10%

Accountability, Action Planning, Active Learning (Inactive), Active Listening, Agile Methodology, Agile Scrum Development, Analytical Thinking, Bias, Coaching, Creativity, Critical Thinking, Cross-Functional Teamwork, Data Analysis Management, Data Collection Management (Inactive), Data Controls, Design, Design Thinking, Empathy, Follow-Through, Group Problem Solving, Growth Mindset, Intellectual Curiosity (Inactive), Long Term Planning, Managing Ambiguity

• Health & Wellbeing
• Personal & Professional Development
• Unconditional Inclusion