Manager Packaging Engineering

• Provide leadership for a team of engineers responsible for InFO, EFB/CoWoS-L, CoWoS-S, WLFO, FCBGA, LGA, and chiplet package manufacturing readiness for new product bring-up at manufacturing sites
• Own team execution for packaging yield, quality, cost, and operational productivity improvement and sustaining activities
• Define technical direction and drive assembly process baseline standardization and continuous improvement across supported manufacturing sites and suppliers
• Oversee packaging interaction activities across assembly, bump, 3D IC, HBM, wafer fab, wafer sort, functional test, and mark/pack to ensure aligned execution and issue resolution
• Partner with assembly manufacturers to enhance process, equipment, and material capability for future-generation technology products
• Work closely with Packaging BU and cross-functional stakeholders to ensure NPI and ramp readiness at manufacturing sites, with disciplined follow-up on team deliverables and timely status reporting
• Manage team performance in driving assembly manufacturing site and supplier performance related to yield, quality, out-of-control lot disposition, and outlier management, with clear closed-loop reporting
• Lead engagement with internal engineering counterparts and broader package engineering, procurement, supply chain, reliability, and other organizations to deliver programs with accurate and timely status updates throughout the product life cycle
• Own strategic supplier management, including relationship management, performance reviews, issue escalation, and alignment to business and technology objectives
• Lead planning and execution of change management initiatives driven by internal or external stakeholders
• Build organizational capability through hiring, coaching, performance management, succession planning, and development of engineering talent and bench strength
• Perform other duties as assigned by the supervisor in support of organizational and business priorities

• Minimum 15 years of experience in InFO or 2.5D/3D bump/TSV/packaging, Flip Chip BGA/LGA, or WLFO process engineering, with strong hands-on experience in assembly manufacturing operations
• Deep knowledge of InFO, chiplet packaging, 2.5D/3D TSV/packaging, Flip Chip BGA/LGA processes, and chip-package interaction
• Demonstrated experience leading and scaling engineering teams, including coaching, performance management, succession planning, and development of technical talent
• Minimum 5 years of experience in supplier management, including performance management, issue escalation, and stakeholder engagement
• Familiarity with DOE, JMP, and data-driven problem-solving methodologies
• Highly motivated leader with the ability to balance strategic direction and operational execution, drive solutions, and lead teams effectively in a fast-paced, multi-tasking environment
• Strong experience preparing reports and executive presentations, and communicating root cause, resolution, and program status effectively to all levels of the organization
• Strong leadership presence with the ability to coach, motivate, and develop engineers while maintaining high standards of technical execution
• Excellent interpersonal, communication, analytical, project management, and prioritization skills
• Proven ability to lead horizontally across multiple internal functional organizations, influence stakeholders, and align external partners
• Experience in a semiconductor engineering environment with NPI through HVM leadership responsibility
• Bachelor/MS degree in Mechanical or Material or Chemical Engineering

MS degree in Mechanical, Materials, Chemical Engineering, or a related field is preferred