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Lead Soc Physical Design Engineer

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AMD

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Location:
India , Bangalore

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Category:
IT - Software Development

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Salary:

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Job Description:

As a member of the Strategic Silicon Solution Group Full Chip Physical Design team, you will help bring to life cutting-edge designs. You will work on Full Chip/Subsystem Floorplan / Netlist, Tile/Block/Partition level Physical Design, Full Chip Static Timing Analysis and Constraints teams, to achieve first pass silicon success. This person will be working on Full chip / Sub-system level Physical Design, Timing Analysis, Synthesis, Logical equivalence, Physical Verification, Power design/implementation/signoff, and will act as a mentor/coach/guide to Design Engineers. Will work very closely with Fellows, Principal Engineers, Architects, Technology/CAD teams and collaborate with cross functional worldwide teams.

Job Responsibility:

  • Full chip level Die size estimation, Floor-planning, Power planning, IO planning, package compatibility, IO ring creation and ESD analysis
  • Full chip Hierarchical planning, block planning , block level constraints, hierarchical clock tree implementation, block integration and chip finishing
  • Low power design with power estimation/optimization including clock gating, power gating, power switch implementation and other low power techniques to reduce total power consumption
  • Full chip/Sub-system/Partition level Synthesis, Logic equivalence, implementation of low power UPF/CPF
  • Full chip / sub-system level constraints, MMMC & cross talk aware timing closure with latest OCV based analysis
  • RTL2GDSII design implementation and flow debug top down or bottoms up at chip level
  • PPA (Power, Performance, Area and Schedule) closure and flow development for key IPs like CPU, Graphics, Multimedia, Fabric cores and/or other critical sub-systems
  • Low Power signoff like Static and Dynamic power analysis at top level and/or sub-system level
  • Full chip / sub system level Clock tree synthesis and advanced clock tree implementation
  • Top level ECO strategy for RTL, pre-physical and post-route implementation considering timing, congestion and logic equivalence
  • Physical design and timing methodology development on a particular node as well as for a specific SOC
  • Automation to improve design PPA (Power, Performance, Area) and ensure a high-quality design environment for an SOC

Requirements:

  • Minimum 15+ years of relevant work experience
  • Expertise in ICC2/FC (Fusion Compiler) Physical Design flows/methodologies or equivalent tools
  • Expertise in Signoff tools like Primetime for Timing, Calibre for DRC/LVS, Ansys Redhawk on EMIR, PT-PX for Power signoff
  • Should have worked as a go to person or technical lead for at least few full chip projects
  • Strong technical leadership and ability to mentor/guide/coach design engineers
  • Strong inter-personal skills and ability to collaborate with teams spread across multiple geos
  • Should have good scripting experience in Shell, Python, Perl, TCL, UNIX along with decode/debug old existing scripts
  • Bachelors or Master's degree in Computer/Electronics/Electrical Engineering
  • Experience in 5nm & below technologies
  • Hands-on in reference flows, excellent debugging skills
  • Must have hands on Physical Design experience and must have handled RTL to GDS II at Top level or Hierarchical top level for at least few tape outs
  • Must have led physical design team/s in the capacity of technical lead or as a go to person
  • Highly accurate and detail-oriented, possessing good communication and problem-solving skills

Additional Information:

Job Posted:
March 19, 2026

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