Lab Technician, DPA (Destructive Physical Analysis) Jobs

IAG GBS

Location:
United States, Irvine

Category:
IT - Administration

Contract Type:
Not provided

Salary:

25.00 - 30.00 USD / Hour

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Job Description:

The DPA Technician performs advanced analysis on integrated circuits, components, relays, connectors, and other electronic devices used in high reliability applications. This role requires a strong engineering mindset, high degree of attention to detail, ability to perform complex procedures, and hands-on proficiency in destructive and non-destructive techniques.

Job Responsibility:

Perform Destructive Physical Analysis (DPA) investigations per MIL-STD methods to identify defects and assess reliability risks
Perform advanced analysis using optical/digital microscopy, SEM/EDS, X-ray (2D/real-time), and C-SAM to characterize component construction and detect anomalies
Conduct cross-sectioning, de-lidding, chemical/plasma etching, hermeticity testing, and other physical analysis techniques
Support test plans for reliability assessments and root cause investigations in collaboration with multidisciplinary teams
Implement new techniques and bring new tools online to enhance lab capabilities
Analyze samples to identify failure initiation sites and construction anomalies
Generate detailed technical reports and present findings to internal teams and customers
Ensure compliance with industry standards (ISO, JEDEC, AEC, IPC) and customer specifications
Interact with other technicians and engineers
mentor team members on best practices
Maintain adherence to safety protocols, Technology Control Plan, and quality system requirements
Protect confidential information and proprietary processes.

Requirements:

U.S. Person as defined by ITAR (U.S. Citizen, U.S. Permanent Resident, Political Asylee or Refugee)
AS degree in Electronics or other technical and science fields highly desired
2+ years of direct experience in Destructive Physical Analysis (DPA), Semiconductor or Electronics Failure Analysis roles
Expertise performing MIL-STD test methods: MIL-STD 883, MIL-STD 750, MIL-STD 1580
Knowledge of and handling of electronics, integrated circuits, and components
High degree of manual dexterity
Meticulous, detail oriented and highly organized
Excellent written and verbal communication skills
Hands-on Experience and Expertise in: Optical and Digital Microscopy, X-ray (real-time/2D), Scanning Acoustic Microscopy (C-SAM), De-lidding of Ceramic and Hybrid IC packages, Chemical Etching, Deprocessing and Parallel Lapping, Plasma Etching, Glassivation integrity testing, Cross Sectioning, Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS), Wire Bond Pull Testing, Die Shear Testing, Fine/Gross Leak Testing, Particle Impact Noise Detection (PIND), Dye Penetrant Testing
Ability to continuously operate a personal computer or lab equipment for extended periods (4+ hours)
Ability to operate a keyboard and other lab equipment
Must be able to remain in a stationary position 80% of the time
Ability to communicate clearly
Ability to handle small and fragile devices with tweezers and/or fingers
Require close-distance visual acuity with or without correction
Must be willing and able to wear PPE
Ability to learn new tasks, remember processes, maintain focus, complete tasks independently, and make timely decisions
Ability to move equipment or items up to 50 lbs.

Nice to have:

Knowledge of other Industry Standards: e.g. ISO, AEC, JEDEC, IPC
Device physics, circuits/schematics, IC design
Operate electrical Bench test equipment (curve tracers, power supplies, ohm meters, o-scopes)
Familiarity of semiconductor fabrication and package manufacturing
Software: GDS layout, LabView
Electronics Failure Analysis techniques and methodology.

What we offer:

401k Company Matching
Wellness Program
Volunteer Time off
Education Assistance
Fitness Reimbursement

Additional Information:

Job Posted:
December 09, 2025

Employment Type:

Fulltime

Work Type:

On-site work

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Lab Technician, DPA (Destructive Physical Analysis)