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Image Sensor Design Engineer

United States, Redmond 178000.00 - 250000.00 USD / Year · Job Posted March 13, 2026
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Job Description

Reality Labs Research (RL-R) brings together a highly interdisciplinary team of researchers and engineers to create the future of augmented/virtual reality and wearable personal AI devices. The Sensors and Systems Research (SSR) team’s goal is to create ultra low power and lightweight photon-to-inference pipelines that enable all-day, always-on contextual AI. The team cultivates an open environment where individuals thrive. We encourage a sense of ownership and embrace the ambiguity that comes with working on the frontiers of research. The SSR team is looking for an Analog & Mixed-Signal Design Engineer who has comprehensive experience with designing image sensors. You'll closely partner with research scientists on designing customized image sensors, building camera prototypes and demonstrating new user experiences we aim to enable. You’ll also act as the bridge between research and product teams to ensure that the novel imaging technology we develop can be smoothly integrated into the camera subsystems of Meta’s future wearable AR/VR/AI products.

Job Responsibility

  • Participate in the development of customized image sensors for future AR/VR/AI devices
  • Propose specification/functional requirements for customized image sensors and align with stakeholders inside SSR and cross-functional teams
  • Perform schematic design, layout design and pre/post-layout simulations for various circuit blocks in customized image sensors
  • Support internal teams to integrate customized image sensors into camera modules and prototyping systems

Requirements

  • Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience
  • Master’s degree in the field of Computer Science, Electrical Engineering or related field
  • 10+ years of experience in analog & mixed-signal IC design including ADCs, readout circuits, driving circuits, controlling circuits, I2C/I3C interfaces and high-speed interfaces in advanced CMOS process nodes
  • Shipped 1 or more semiconductor products in mass production
  • Experience with PCB design
  • Experience with chip testing
  • Familiar with pixel operating principles for both rolling-shutter and global-shutter image sensors
  • Familiar with state-of-the-art 3D stacking process for image sensors fabrication

Nice to have

  • A Ph.D. degree in the field of Computer Science, Electrical Engineering or related field
  • Experience with designing image sensors in advanced 3D stacking process
  • Experience with designing camera system prototypes

What we offer

  • bonus
  • equity
  • benefits

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