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IC Package design engineer

India, Bangalore · Job Posted February 19, 2026
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Job Description

Join the Package Design Team at Cisco Silicon One in Armenia, a group leading the way in developing Cisco's groundbreaking silicon solutions for next-generation networking. As a collaborative team at the center of Cisco's silicon development, we design and optimize advanced package solutions for some of the industry’s most sophisticated ASICs. You’ll work directly with experts in layout, signal integrity, and power distribution, shaping innovative methodologies and driving the evolution of high-performance networking technologies.

Job Responsibility

  • Lead package design tasks, planning and driving schedules from concept through implementation
  • Optimize package pinouts, stack-ups, power distribution, and high-speed routing, balancing performance and manufacturability
  • Collaborate with silicon floor planning, signal integrity (SI), and power integrity (PI) teams to ensure design quality and efficiency
  • Work closely with layout editors to deliver high-quality package designs aligned with interface requirements
  • Enhance design methodologies and partner with vendors to improve product quality and efficiency
  • Drive innovation in package solutions for Cisco’s next-generation ASICs

Requirements

  • Over 3 years of experience in package layout design
  • Skilled in high-speed layout design, such as PCIe, DDR, and SerDes technologies
  • Proficient in using the Cadence APD layout tool

Nice to have

Experience with multi-die package and interposer designs

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