Hardware Engineering Manager

You will be part of Lam Research’s Equipment Intelligence and Sensor Engineering organization within the Deposition Product Group (DPG). This team is responsible for developing next-generation sensing, imaging, and data-driven capabilities that enable differentiated performance across Lam’s product portfolio. The organization focuses on integrating advanced sensor systems—including optical, thermal, acoustic, chemical, and multi-modal sensing—into semiconductor capital equipment to enable real-time visibility, control, and optimization. This includes development of modular sensor platforms, edge compute architectures, and scalable system integrations that support both new product introduction (NPI) and installed base enhancement. Our teams operate at the intersection of mechanical systems, optics, electronics, controls, software, and data science—partnering globally to deliver robust, high-performance solutions that accelerate innovation, improve tool intelligence, and enable next-generation capabilities across all Lam product lines. The organization operates in a matrix structure, where mechanical, electrical, optical, and software engineers collaborate closely across shared programs and platforms, requiring strong cross-functional alignment and shared ownership of outcomes.