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Hardware Engineering Manager - Semiconductor Test Platform

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Teradyne

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Location:
United States , Agoura Hills

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Category:
IT - Software Development

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Contract Type:
Not provided

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Salary:

201000.00 - 321600.00 USD / Year
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Job Description:

We are seeking a strategic and technically adept senior leader to drive the execution of semiconductor test platform programs. This role requires deep experience in test cell architecture, cross-functional team leadership, and a strong understanding of both wafer-level and packaged device testing. The ideal candidate will have a proven track record of delivering integrated test solutions that span mechanical, electrical, software, firmware, and signal delivery domains.

Job Responsibility:

  • Lead the full lifecycle of semiconductor test platform projects—from concept through deployment
  • Manage and align cross-functional engineering teams
  • Oversee semiconductor test cell integration, including handler interfaces, thermal control systems, and automation workflows
  • Drive platform development for wafer-level and packaged device testing
  • Collaborate with probe card designers and probing technology experts
  • Partner with internal stakeholders and customers to define requirements
  • Develop and manage detailed project plans, track milestones, and mitigate risks
  • Build and mentor a high-performing team of program managers and technical leads
  • Provide regular updates to senior leadership on program status, risks, and strategic decisions

Requirements:

  • Bachelor’s or Master’s degree in Electrical, Mechanical, or Computer Engineering
  • 10+ years of experience in semiconductor test systems
  • 5+ years in a leadership role
  • Proven success in leading multidisciplinary engineering teams and delivering complex test platforms
  • Deep understanding of ATE systems, test methodologies, and semiconductor manufacturing processes
  • Strong organizational, communication, and strategic planning skills

Nice to have:

  • Semiconductor test cell architecture and integration
  • Wafer-level and packaged device testing, including probe card and socket technologies
  • Probe solutions for advanced nodes and high-density interconnects
  • High-speed signal integrity and test interface design
  • Collaboration with global teams and external suppliers
  • Familiarity with compliance, reliability, and environmental testing standards
What we offer:
  • Discretionary bonus(es) based on financial performance
  • Medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs

Additional Information:

Job Posted:
January 26, 2026

Employment Type:
Fulltime
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