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As part of AMD's S3 (Semi-Custom) organization, you will work within the Physical Design integration team to translate SoC RTL into a full-chip floorplan, enabling downstream implementation and first-pass silicon success. This role operates at the intersection of architecture, RTL, DFT/DFX, and physical design, with a primary focus on defining chip-level structure early in the design cycle. It is a highly hands-on, execution-driven role requiring deep expertise in full-chip floorplanning and physical design.
Job Responsibility
Own full-chip floorplanning (partitioning, macro placement, integration)