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Application engineer supports NTP(Node Transition Project) work stream, reach to customer requested performance by providing tailored solution for a new node device. Also supports customer on product issue and drives towards resolution.
Job Responsibility:
Perform technical analysis on overlay/imaging data
Examine analysis result, and connect it to a suitable solution
Collaborate with an overlay or imaging expert engineer from head quarter
Communicate with both internal/external customers, in Japanese/English language
Do presentation of analysis result towards external customers
Able to understand customer needs, align clear problem description with customer, trouble shooting under time pressure condition
Take ownership and initiative, required prompt response
lead escalation and communication with ASML experts (ABS, DE, GSC) internally, and act as customer interface
collaborate across departments for smooth trouble shooting
stakeholder management for technical topics
problem solving mindset
support EUV, DUV, YS, VCP
Requirements:
More than 2 yrs experience in semiconductor industry
Above BS degree in Physical Sciences, Optics, Electrical Engineering, Chemical Engineering, Materials Science, Mathematics etc.
Flexibility and quick response
Describe clear problem description including customer use case
Able to create user friendly technical document using common words (not ASML specific term)
Trouble shooting skill, data analysis skill, MS excel, powerpoint skill
Basic project management skill
English skill requirements : TOEIC >600, daily conversation level
Japanese skill requirements : JLPT N2 or higher, daily conversation level
Japanese/English presentation, communication skill to lead technical conversation internally and externally
lead technical conversation by Japanese in customer meeting