Engineer, Manufacturing Equipment Engineering (Wire Bond) Job at Sandisk (Batu Kawan)

Senior Engineer, Wire Bond Process Dev Engineering

Wire Bond Process Engineer is responsible for developing, optimizing, and sustai...

Location

Malaysia , Batu Kawan

Salary:

Not provided

Sandisk

Expiration Date

Until further notice

Requirements

Min Bachelor or higher Engineering degree (Material/Mechanical/ Mechatronics/E&E, Physics & etc)
Possessed at least 2-4 years of working experience in wire bond development process
JMP/MiniTab /8D /Six Sigma/ SPC

Job Responsibility

Define process windows and establish recipe baselines for Wire Bond processes using JMP DOE
Perform effective root cause analysis (5 Whys, DMAIC, 8D) for Wire Bond defects, equipment issues, and yield losses
Work closely with cross‑site Package Development teams to understand package design rules and Wire Bond requirements (pad layout, bondability, material compatibility)
Ensure smooth transition from Development to NPI/Qualification, focusing on Wire Bond process readiness
Collaborate with manufacturing, equipment, and process development teams to optimize Wire Bond parameters, bonding programs, and equipment capability
Prepare and maintain SOP, WI, FMEA, OCAP, and Control Plan related to Wire Bond processes
Ensure effective handover of Wire Bond processes to production for new device/product introduction
Handle new material/component first article inspection (e.g., wire type, capillary, leadframe, substrate bondability)
Drive continuous improvement in Wire Bond cost, UPH, yield, and material efficiency
Maintain strong process control to meet Wire Bond yield, throughput, and quality targets

Fulltime

Semiconductor Packaging Engineer

The Semiconductor Packaging Engineer is responsible for developing, executing, a...

Location

United States , Redmond

Salary:

Not provided

Sigma Design

Expiration Date

Until further notice

Requirements

Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Materials Science, or related technical field or equivalent professional experience required
Minimum of 1+ years of relevant work experience in semiconductor manufacturing, advanced packaging, or related electronics manufacturing environments preferred
Strong background in semiconductor or advanced packaging processes, including wafer-level or panel-level manufacturing
Hands-on experience working with semiconductor assembly and packaging equipment
Experience designing and executing Design of Experiments (DOE), analyzing results, and optimizing manufacturing yield
Experience collaborating across research and development, hardware engineering, and manufacturing teams
Strong analytical, troubleshooting, and problem-solving skills with an innovation and scalability mindset
Experience with advanced packaging technologies such as Flexible Printed Circuits (FPC), Printed Circuit Board Assembly (PCBA), 2.5D/3D integration, or related electronic packaging technologies
Experience working with back-end-of-line (BEOL) and advanced packaging processes including technologies such as thinning, grinding, dicing, soldering, eutectic bonding, electrochemical deposition or metal finishing, through-silicon vias (TSV), flip-chip bonding, wire or die bonding, bumping, thermocompression bonding, copper pillar bonding, hybrid bonding, underfill processes, and overmolding or encapsulation
Experience handling and integrating thinned electronic components as part of advanced packaging workflows

Job Responsibility

Lead assembly and integration engineering efforts with emphasis on Surface Mount Technology (SMT), Die Bond/Wire Bond processes, and support activities related to molding, laser fabrication, panel or wafer lamination, and component thinning, planarization, and dicing
Develop and implement advanced packaging solutions to enable heterogeneous, flexible, and stretchable integration of electronic components and devices
Design and oversee internal, external, and hybrid manufacturing workflows to accelerate development, integration, and scale-up of advanced electronic packaging technologies
Develop new methods and processes to close technology gaps, improve device performance, and increase manufacturing yield through process innovation and optimization
Design and execute experiments (DOE), analyze experimental results, and apply findings to improve packaging processes, device performance, and yield
Execute hands-on fabrication workflows using advanced packaging and assembly equipment, identify in-line process issues, and propose solutions or workarounds to improve manufacturing performance
Collaborate closely with researchers, hardware engineers, system integration teams, and external manufacturing partners to support the development and production of advanced electronic packaging solutions
Support the development and use of high-performance electronic materials in advanced packaging environments
Contribute to instrumentation development, process characterization, mechanical or layout design, and data analysis methods used in hardware research and development environments
Follow Business Technology policies to protect sensitive data and reduce information security occurrences

What we offer

competitive compensation
a 401(k) with up to 4% company match
quarterly bonus program
15-days of accrued PTO
9 company paid holidays
multiple options for medical insurance
dental insurance
voluntary benefits: vision, long-term disability, and life insurance

Fulltime

Senior Photonics Packaging Engineer

Develops and implements production/processing methods and controls to meet quali...

Location

Canada , Kanata

Salary:

Not provided

The Muse

Expiration Date

Until further notice

Requirements

At least five years of compatible experience with advanced packaging, particularly flip-chip, die bond, wire bond and alignment
Master level or above degree in related discipline

Job Responsibility

Develop new assembly processes including material selection, methods and continuous improvement
Operate production and test equipment in a prototype/NPI line
Work with colleague engineers, technicians and operators for NPI and prototype production
Act as equipment prime for specific machines, driving procurement, maintenance, spares and service as required
May lead the startup of new/existing projects/production jobs, optimizing cost, efficiency and quality
May lead the process control and maintain appropriate documentation
Monitor the assembly/molding process running in production
troubleshoot problems associated with processes, and assist in resolving quality issues
Establish detailed processes for new product lines
document product development and changes

What we offer

Health Insurance
Dental Insurance
Vision Insurance
FSA
HSA
On-Site Gym
Health Reimbursement Account
Life Insurance
Short-Term Disability
Long-Term Disability

Fulltime

Process Engineer / Staff Engineer (Wirebond)

We are partnering with global manufacturer of essential electronic components th...

Location

Malaysia

Salary:

5000.00 - 12000.00 MYR / Month

Randstad

Expiration Date

May 01, 2026

Requirements

Bachelor’s degree in Engineering (Mechanical, Electrical, Materials, or related field)
Previous experience in a technical or manufacturing environment, specifically working with automated bonding or precision assembly equipment
Understanding of wire pull and ball shear testing, as well as basic statistical process control (SPC)
Strong problem-solving abilities and the communication skills needed to work with both operators and management

Job Responsibility

Process Setup: Define and optimize bonding parameters including ultrasonic energy, force, time, and temperature
Troubleshooting: Perform root-cause analysis on bonding failures (e.g., non-sticks, looping issues, or bond lift-offs) and implement corrective actions
Yield & Quality: Monitor production yields and use statistical tools to reduce variability and prevent defects
Equipment Support: Work with the maintenance team to ensure wirebond machinery is calibrated and performing at peak capacity
New Product Setup: Create and validate new programs, bond maps, and recipes for incoming product designs
Documentation: Maintain standard operating procedures (SOPs), control plans, and process flowcharts

Director, Battery Pack Engineering

ALSO is seeking a technical leader who can grow high-performing engineering team...

Location

United States , Palo Alto

Salary:

250000.00 - 320000.00 USD / Year

ALSO

Expiration Date

Until further notice

Requirements

BS or higher in engineering (mechanical or related) with strong grounding in mechanical design, structures, and heat transfer
Proven track record of industrializing multiple high-quality, high-volume battery packs or modules (0.5–8 kWh+ energy range)
Exceptional first-principles mechanical engineering skills with strong analytical, modeling, and design capabilities
Deep understanding of lithium-ion batteries, including operating principles, chemistry tradeoffs, failure modes, safety-by-design strategies, cell manufacturing, and the supplier landscape
Hands-on experience with safety-critical design, testing, and iteration, including strategies for controlled energy release during severe failure events
Strong experience working with contract manufacturers, including design release, documentation control, build readiness, on-site collaboration, and ramp-to-mass-production execution
Ability to develop and industrialize advanced manufacturing processes, such as wire bonding, laser welding, adhesive dispensing, and related joining/assembly flows
Strong understanding of battery safety and reliability qualification, including shock/vibration, environmental stress, abuse testing, and single-cell initiation methods
capable of building and interpreting test plans aligned with UL/IEC/UN regulations
Knowledge of physics-based modeling for battery cells and packs, plus familiarity with BMS algorithm design and performance methods

Job Responsibility

Lead end-to-end battery pack product development, including detailed mechanical design, validation and testing, DFM/DFX, high-volume manufacturing ramp, certification, and continuous product and process improvements
Manage multiple battery technology and product development workstreams spanning early concept, detailed design, validation, launch, and sustaining engineering
Grow and lead several small engineering teams across mechanical design, test, modeling, and requirements engineering
provide coaching, prioritization, and technical guidance
Develop and maintain strong relationships with battery cell suppliers and drive cell selection and qualification for each new application
Expand cell- and pack-level performance and safety testing capabilities, including lab infrastructure, equipment, and test processes
Advance cell- and pack-level electrical, thermal, life, and health modeling capabilities to support design, controls, and safety analysis
Collaborate closely with Systems Engineering, Product Architecture, BMS hardware, and Controls Engineering to deliver integrated, high-performance battery systems

What we offer

Robust health coverage. Excellent health, dental and vision insurance covered up to 100% by ALSO with FSA & HSA options
One Medical membership and dedicated insurance advocates
Rich fertility and family building benefits with Progyny
Flexible time off
401(k) match

Fulltime

Electrode Manufacturing Technician I

The Electrode Manufacturing Technician I plays a key role in the hands-on fabric...

Location

United States , Salt Lake City

Salary:

Not provided

Blackrock Neurotech

Expiration Date

Until further notice

Requirements

Minimum high school diploma and/or AA or equivalent
0-1 years experience in electronics and/or medical device manufacturing environment, preferably in clean room setting working with small parts
GMP training or experience
Thorough and detail oriented
Excellent reading, writing and communication skills in the English language
Able to work independently with little supervision
Able to handle stressful situations
Excellent interpersonal skills
Must be proficient in computer skills with 2 years’ experience using Microsoft Office
Knowledge of FDA/ISO for medical devices

Job Responsibility

Build acute and chronic microelectrode array implant assemblies in a controlled cleanroom environment
Perform detailed assembly work under a microscope, handling very small components with care
Complete tasks such as wire bonding, micro-soldering, adhesive application, and precise component placement
Follow step-by-step work instructions, procedures, and engineering drawings
Inspect work during the build process and perform basic functional checks to ensure quality
Accurately document production work in accordance with GMP and ISO/FDA requirements
Identify defects or process issues and escalate or support basic troubleshooting
Follow cleanroom protocols, including gowning and contamination control
Support material preparation, inventory handling, and production setup
Work closely with Manufacturing Engineering and Quality teams to support ongoing improvements

Fulltime

UAS Technician

The UAS Technician is responsible for the inspection, maintenance, repair, integ...

Location

United Kingdom , West Wales

Salary:

Not provided

Tekever

Expiration Date

Until further notice

Requirements

Degree or certification in STEM fields (e.g., engineering, electronics, robotics)
Proven experience in avionics maintenance or UAV systems
Self-motivated and adaptable with strong problem-solving skills
Clean driving license and ability to obtain security clearance
Excellent communication skills and attention to detail

Job Responsibility

Perform assembly, disassembly, and integration of UAS airframes and sub-systems
Conduct structural inspections on composite, metallic, and hybrid structures
Carry out composite repairs (skins, cores, bonded structures, inserts, doublers)
Install and torque mechanical fasteners in accordance with engineering drawings
Perform rigging, alignment, and mechanical system adjustments
Identify and report structural defects, damage, or non-conformities
Install, wire, and troubleshoot avionics systems including: Flight control systems, Autopilots and navigation systems, Power distribution systems, Sensors and payload interfaces
Manufacture and repair wiring looms/harnesses to approved standards
Conduct continuity, insulation resistance, and functional electrical testing
Integrate communication systems, antennas, and RF components

What we offer

An excellent work environment and an opportunity to make a difference
Salary Compatible with the level of proven experience

Fulltime

Senior Estimator

Aplin has partnered with a reputable company to recruit a Senior Estimator speci...

Location

Canada , Calgary

Salary:

Not provided

Aplin

Expiration Date

Until further notice

Requirements

Strong knowledge of Microsoft Office with the ability to develop templates, track changes, create spreadsheets, and use formulas
10+ years related to underground utility infrastructure experience
P.Eng or CET is preferred
Experience reading and understanding blueprints, specifications, schedules, and costing reports is required
A thorough understanding of the construction process, environmental regulations, and safety practices is required
Excellent verbal and written communication skills
Previous experience using B2W software is an asset
Previous leadership or manager experience is an asset
Proven experience in construction estimating, preferably in commercial or industrial projects
Strong knowledge of construction materials, methods, and techniques

Job Responsibility

Estimate civil earthworks and underground projects
Evaluate multiple sub-trade executions, strategies, and estimates
Be accountable for sub-trade strategies and estimates
Accountable for the entire proposal package submission
Accountability for the overall construction plan, including schedule, concept, budget, procurement, and risk assessment
Prepares and maintains the status of plans
Prepares subcontractor bid packages
Transmits addenda and other bid information to subcontractors
Produce bid package for Project Manager and Superintendent including labor and equipment budgets, material suppliers, subcontractors, tender specifications, and contracts
Accountability for updating the database and costing system with project data to ensure cost is current

What we offer

Competitive Salary and Benefits
Paid Christmas shutdown
RSSP program with employer match
Pension plan
Company phone, cellphone plan, and tools provided
Performance-based bonus structure

Fulltime

Engineer, Manufacturing Equipment Engineering (Wire Bond)

Sandisk

Location:
Malaysia , Batu Kawan

Category:
Manufacturing

Contract Type:
Not provided

Salary:

Job Description:

Job Responsibility:

Requirements:

Nice to have:

Additional Information:

Job Posted:
January 18, 2026

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