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Engineer, Manufacturing Equipment Engineering (Die Bond)

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Sandisk

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Location:
Malaysia , Batu Kawan

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Contract Type:
Not provided

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Salary:

Not provided

Job Description:

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Job Responsibility:

  • Responsible for Equipment Engineering KPI which is MTBA, OEE, machine downtime, Quality and Preventive maintenance
  • Ability to support on hardown machines and assist technician to troubleshoot the machine
  • Ability to support on machines improvement in term of productivity and quality
  • Able to support offline / online when production line down or crisis issue

Requirements:

  • Bachelor / master in Electrical & Electronic / Mechatronic / Mechanical or equivalent field
  • Good communication skill
  • Expert in excel and power point

Nice to have:

  • Familiarity in computer system & computer network
  • Familiarity in MS Excel, Word, Power Point & Outlook
  • Able to work independently
  • Have a good interpersonal skill
  • Able to multitask

Additional Information:

Job Posted:
January 18, 2026

Employment Type:
Fulltime
Work Type:
On-site work
Job Link Share:
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