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Tucker Parker Smith Group Logo Tucker Parker Smith Group · IT - Software Development

Electronics Engineer III

United States, Irvine Contract work 64.00 USD / Hour · Job Posted June 16, 2026
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Job Description

We are seeking an experienced Electronics Engineer III to join a highly collaborative engineering team focused on developing advanced high-performance storage and computing solutions. This is an exciting opportunity to work on complex, high-speed PCB designs while partnering with global engineering teams to bring innovative products from concept to production. In this role, you will play a key part in the design and development of sophisticated rigid and rigid-flex printed circuit boards, contributing to products that demand exceptional performance, reliability, and precision.

Job Responsibility

  • Design and develop complex multilayer rigid and rigid-flex PCB layouts for advanced electronic systems
  • Take PCB designs from schematic netlist through final manufacturing release, including ODB and Gerber generation
  • Collaborate closely with Mechanical, Signal Integrity (SI), Power Integrity (PI), Thermal, Manufacturing, and Product Engineering teams
  • Route and optimize high-speed interfaces including DDR memory, PCIe, NAND flash, and other critical signal paths
  • Work directly with fabrication and assembly vendors to resolve DFM issues and support successful product launches
  • Participate in design reviews and contribute to best practices for PCB design methodologies, materials, processes, and tools
  • Solve challenging packaging, routing, and layout constraints while balancing performance, manufacturability, and reliability
  • Partner with engineering teams located across North America, Asia, and the Middle East to support globally developed products

Requirements

  • Bachelor's Degree in Electrical Engineering, Electronics Engineering, or a related technical discipline
  • Minimum of 5 years of professional PCB layout experience
  • Strong proficiency with Cadence Allegro PCB Designer
  • Demonstrated experience designing complex, high-density, multilayer PCB layouts
  • Experience with high-speed digital designs involving: DDR memory interfaces
  • PCIe architectures
  • NAND Flash memory
  • Hands-on experience with advanced PCB technologies including: Blind and buried vias
  • Microvias
  • Through-hole technologies
  • Rigid-flex PCB designs
  • Strong understanding of PCB manufacturing processes, design for manufacturability (DFM), and vendor collaboration
  • Ability to work independently while contributing effectively within a highly collaborative team environment

Nice to have

  • Experience with System Capture and EDM library management
  • Background supporting enterprise hardware, storage, networking, computing, or high-performance electronic products
  • Familiarity with advanced packaging technologies and signal integrity considerations
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