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Electronic Board Designer

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Palladyne AI

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Location:
United States , Kansas City

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Contract Type:
Not provided

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Salary:

Not provided

Job Description:

GuideTech, a subsidiary of Palladyne AI, builds high-performance avionics and autonomy software for aerospace, space, and defense systems. We support a wide array of vehicles, from small multi-rotors, heavy lift UAVs, unmanned fighter jets, launch vehicles, spacecraft, re-entry vehicles, missiles and counter-UAS interceptors. Our BRAIN flight computer pairs an NVIDIA Jetson Orin autonomy module with a Zynq-7000 real-time module for flight-critical Guidance/Navigation/Control, sensors, and I/O. We outsource PCB fabrication and SMT assembly, and perform in-house inspection, bring-up, test, and final assembly of our board stack—so you’ll see designs through to working hardware. We also leverage hardware-in-the-loop (HIL) flight simulation with our FLEX software and simulation to accelerate integration & test.

Job Responsibility:

  • Collaborate on BRAIN: Contribute to schematics, constraints, and layout guidance for the BRAIN stack
  • partner with the current designer on reviews, DFM/DFT, and controlled releases
  • Support board bring-up & troubleshooting across high-speed and sensor I/O
  • Develop/maintain FPGA RTL (Zynq-7000 SoC): IP integration, constraints, timing closure, and deterministic I/O for controls/sensors
  • Build functional test fixtures & automation (ATE) and integrate with Hardware-in-the-Loop Simulation
  • Lead new designs (near-term pipeline) such as: ESCs (BLDC), Gimbal controllers, UAV PDBs, AI / CV boards
  • For each: deliver concept ? schematics ? constraints/stack-up ? DFM/DFT ? CM handoff ? bring-up & verification ? production test
  • Production & Quality (scale-up): Contribute to the quality & test plan
  • Prepare manufacturing build packages, work with contract manufacturers on DFM feedback, and drive ECNs/PCNs
  • Contribute to failure analysis and corrective actions

Requirements:

  • Electrical Engineering or related degree
  • Board level design/integration: RS422/SPI/I2C/CAN/USB3/MIPI/PCIe/etc, DDR Memory, MIPI Camera Interfaces, Power Supplies
  • Board assembly/prototyping: Stencil/non-stencil assembly, 0402/QFN/LGA/BGA (0.8mm+ pitch) hand assembly for prototyping
  • Board Certification: Industry standard testing, Shock/Vibe/EMI/etc
  • Board rework: Hot plate, Hot air, Soldering certification
  • Board analysis: Software drivers, VHDL/Verilog IP Blocks, Signal Analysis (Oscilliscope/Logic Analyzer)
  • Strong DFM/DFT instincts and collaboration with contract manufacturers (PCB fab + SMT)
  • Able to lab bring-up & debug (power trees, signal integrity, JTAG/boundary-scan, EMC/ESD hygiene)
  • Construct clear documentation (schematics, fab/assembly notes, ATP/QTP, ECNs) and team-first communication

Nice to have:

  • Power electronics experience (buck/boost, BLDC/FOC, gate-driver layout, thermal design)
  • Camera systems & Jetson bring-up (device tree, drivers, camera tuning)
  • Sensor/actuator interfacing for GNC (IMUs, mag, baro, GPS/UWB
  • PWM/DSHOT/serial buses)
  • HIL/SIL workflows
  • test automation (Python/C++)
  • familiarity with FLEX flight software
  • IPC/avionics standards (IPC-2221, IPC-A-610/J-STD-001, DO-254/DO-160) and AS9100 environments
What we offer:
  • Competitive pay
  • Range of meaningful benefits
  • Potential equity
  • Bonus
  • Perks
  • Investment in continuous learning, leadership development, and career progression

Additional Information:

Job Posted:
January 17, 2026

Employment Type:
Fulltime
Work Type:
On-site work
Job Link Share:

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