Director, External Manufacturing Operations (Backend Engineering)

• Plan, Drive and Manage Substrate & PCB supplier and AMD internal stakeholders from NPI bring up/Qualification/ Ramp Up readiness to Production release and sustaining.
• Supplier Qualification - NPI to LVM to HVM, with First pass and Issue free production for 6 months to ensure Repeatability and Reproducibility.
• Substrate & PCB supplier's new production site bring up & qualification.
• Drive HVM yield attainment, sustaining-issue resolution and issue prevention and improvements through Data Analytics. System Integration with Data Analytics to have real time update and control over supplier overall performance.
• Lead knowledge-sharing initiatives (Best Known Methods, lessons learned) and drive Continuous Improvement Projects (CIPs).
• Monitor & Drive supplier performance using scorecards and lead quarterly technical reviews to ensure improvements.
• Lead projects to drive cross supplier performance improvement/quality enhancement
• Drive for supplier engagement on continuous improvement. Drive supplier to enhance process, equipment & material capability for future generation/technology products and capabilities ahead of roadmap needs.
• Plan and execute change management.
• Responsibilities will include defining and managing Key Program deliverables/schedules/budget/Analyze program risk and opportunities & monitor progress to drive to ensure goals are met.
• Self-Driven/Lead, manage, develop a motivated high-performance team with Improved bench strength and drive to achieve Next 5% to continue to stay ahead of the curve. Reach-out before Reached with respect to RnR.
• Build effective team and strategic relationship across the network. Manage and resolve conflicts.
• Involve in regional supplier management.
• Job may include other duties as assigned/ deemed fit by supervisor.

• Minimum 20 years+ experience in IC Substrate/PCB Engineering & Operations or with Fabless companies (Managing substrate suppliers).
• Experience in Co-working/managing horizontally across multiple internal functional organizations.
• Technical expertise in FC-BGA, LGA, Adv PKG Substrates & PCB Manufacturing /Development and related Interactions.
• Experience in substrate/PCB development, from NPI to HVM, is a plus.
• Team player with a commitment to meeting deadlines/Lead & Drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment.
• Creative, Self-Driven, highly motivated individual with demonstrated ability to independently manage complex engineering tasks.
• Strong interpersonal communication, analytical, project management, task & time management and excellent executive presentation & communication skills.
• Strong Statistical knowledge Familiar with failure analysis tool, package reliability knowledge and Industry standards is essential
• People management skills.
• Good English speaking, Executive communication, and Presentation skills.
• Ability and Willingness to travel internationally is required
• Bachelor/MS degree in Mechanical Electrical or Material or Chemical Engineering

Experience in substrate/PCB development, from NPI to HVM