Director, Advanced Packaging Lab Job at AMD (Singapore)

Job Description

AMD’s Heterogenous Technology Integration (HIT) team is seeking an experienced leader to establish its Singapore Advanced Packaging Lab, a multi-disciplinary lab focused on accelerating the development of advanced packaging technologies for AMD’s AI product portfolio.

Job Responsibility

Build and lead a multidisciplinary team to establish and scale advanced measurement and characterization capabilities across key domains, including: Optical: Drive characterization of optical interconnects at component and channel level to support next-generation packaging architectures
Electrical: Lead characterization of passives (capacitors, inductors), high-speed IO structures, and electrical properties of packaging materials
Mechanical: Oversee measurement of mechanical properties of packaging materials, including warpage and structural integrity of substrates and fully assembled packages
Thermal: Establish capabilities to evaluate thermal properties of next-generation TIMs and materials, including development of short-loop thermal test vehicles to assess future packaging architectures
Imaging: Develop and expand advanced imaging capabilities, including optical and electron microscopy, X-ray imaging, and spectroscopy
Define and execute the lab’s technical roadmap in alignment with AMD’s AI packaging strategy
Build and scale a high-performing team with deep domain expertise across metrology and characterization
Drive collaboration with global engineering teams (design, simulation, manufacturing) and external partners to accelerate capability development
Establish strong partnerships with equipment vendors, research institutions, and ecosystem partners to enable innovation in measurement technologies
Engage with Asia-based manufacturing partners to ensure alignment between lab capabilities and production needs

Requirements

Extensive experience in advanced packaging, metrology, characterization, and design validation of semiconductor components, packages, and platforms, with a strong understanding of end-to-end development lifecycles from concept through manufacturing
Hands-on experience in one or more of the core technical domains outlined (optical, electrical, mechanical, thermal, imaging), with the ability to apply this expertise to solve complex, cross-disciplinary challenges in advanced packaging environments
Proven experience in developing, deploying, or scaling measurement and characterization methodologies, including working with internal teams and external partners to enhance technical capabilities
Strong experience in data collection, analysis, and interpretation, including the application of statistical methods to derive insights, validate performance, and guide engineering decisions
Demonstrated ability to operate effectively in both independent and highly collaborative environments, contributing as an individual technical expert while also aligning with cross-functional teams such as design, simulation, manufacturing, and external partners
Experience working with equipment suppliers, research institutions, or industry collaborators to drive innovation in metrology tools, instrumentation, or experimental methods is highly advantageous
Ability to translate complex technical data into clear insights and communicate effectively with both technical and non-technical stakeholders
Bachelor/Master in Mechanical / Electrical Engineering, Material Science, Physics or equivalent

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Director, Advanced Packaging Lab

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