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Data Center System Interconnect Engineer

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AMD

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Location:
United States , Austin

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Category:
IT - Software Development

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Contract Type:
Not provided

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Salary:

171200.00 - 256800.00 USD / Year
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Job Description:

AMD is driving innovation in data center infrastructure, enabling next-generation AI, cloud, and high-performance computing platforms through advanced interconnect solutions. As a Data Center System Interconnect Engineer, you will lead the design and development of high-speed connectors, cables, and sockets that form the backbone of modern server and rack-scale architectures. This role blends deep technical expertise with system-level thinking to deliver scalable, reliable, and cost-optimized interconnect solutions that power AMD’s leadership in hyperscale and enterprise environments.

Job Responsibility:

  • Own end-to-end development of high-speed interconnect components—connectors, cables, and sockets—optimized for data center platforms and rack-scale deployments
  • Architect advanced interconnect solutions for emerging packaging technologies, multi-node systems, and high-density racks, influencing platform-level design decisions
  • Lead performance validation through signal integrity analysis, mechanical reliability testing, and compliance with industry standards for high-speed data transmission
  • Develop and qualify interconnect ecosystems including test boards, fixtures, and evaluation methodologies to ensure readiness for high-volume manufacturing
  • Manage multi-supplier programs to accelerate innovation and maintain a robust supply chain for critical interconnect technologies
  • Collaborate cross-functionally with packaging, board, and system teams to optimize interconnect performance across electrical, mechanical, and thermal domains
  • Create and maintain technical documentation including specifications, BOMs, and assembly guidelines for manufacturing and quality assurance
  • Drive continuous improvement by mentoring teams, fostering innovation, and advancing AMD’s interconnect technology roadmap

Requirements:

  • Proven experience in high-speed interconnect technologies for data center systems, including connectors, cables, and sockets
  • Expertise in mechanical tolerance analysis (RSS/Monte Carlo) and connector reliability standards
  • Hands-on experience with signal integrity principles, VNA measurements, and failure analysis of separable interfaces and solder joints
  • Familiarity with contact metallurgy, plating finishes, and root cause analysis for interconnect failures
  • Strong program leadership skills with experience managing supplier development and qualification
  • Proficiency in CAD tools (AutoCAD, SolidWorks), simulation tools (LabVIEW, MATLAB, JMP), and structural FEA is a plus
  • Excellent communication skills for technical documentation and executive presentations
  • BS/MS in Mechanical, Electrical, Materials, or Systems Engineering (Ph.D. preferred)

Additional Information:

Job Posted:
January 06, 2026

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