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Asic Physical Design Engineer

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Hewlett Packard Enterprise

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Location:
United States , San Jose

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Category:
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Contract Type:
Employment contract

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Salary:

148000.00 - 340500.00 USD / Year
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Job Description:

Designs, analyzes, develops, modifies and evaluates VLSI components and hardware systems. Determines architecture and logic design, design verification through software developed for component and system simulation, and builds physical implementations through development of multidimensional designs involving the layout of complex integrated circuits.

Job Responsibility:

  • Implement physical design at the large SoC chip level from RTL to GDSII
  • create a design database ready for manufacturing
  • Interact with IP vendors to understand IP integration requirements and integrate all blocks
  • IPs
  • and sub-chips at a large SoC level
  • Collaborate with the packaging team on Microbump/Probe Bump/Bump/Pad placement
  • Build full chip floorplan
  • including pads/ports/bump placement
  • block placement and optimization
  • block pins placement and alignment
  • power grid
  • and RDL design
  • Develop the chip-level clock network and clock stations in collaboration with clock experts
  • Budget timing among blocks and sub-chips at the chip level
  • generating block/chip-level static timing constraints
  • Arrange
  • analyze
  • and optimize feedthrough and repeaters among all blocks/sub-chips at the chip level
  • Perform block-level place and route
  • ensuring the design meets timing
  • area
  • power constraints
  • and all sign-off criteria
  • Generate and implement ECOs to fix timing
  • signal integrity
  • EM/IR violations
  • PV
  • and complete formal verification
  • Integrate DFT into physical design
  • ensuring alignment with overall test strategies and manufacturing requirements
  • Run Physical Design verification flow at chip/block level
  • fixing LVS/DRC/ERC/ANT violations
  • Collaborate closely with architecture
  • frontend design
  • DV
  • and package teams to ensure cohesive design implementation and successful project tapeouts

Requirements:

  • BS degree in electrical engineering
  • computer engineering
  • or a related field with 7+ years of experience in block or full-chip physical design
  • Deep design experience in large SoC designs
  • including IP integration
  • padring design
  • bump planning
  • and RDL routing strategy
  • Extensive knowledge and practices in Physical Design
  • including physically aware synthesis
  • floor-planning
  • place & route
  • CTS
  • and repeater/feedthrough
  • Experience in developing and implementing power-grid and clock network at chip level
  • Knowledge of basic SoC architecture and HDL languages like Verilog to work with the logic design team for timing fixes
  • Experience in physical design verification to debug LVS/DRC/ERC/ANT issues at chip/block level
  • Exposure to 2.5D/3D packaging
  • High performance and large chip design experience preferred
  • Exposure to DFT
  • Proficiency in writing Linux shell scripts in Perl
  • TCL
  • and Python
  • Real chip tapeout experience in 7nm and/or below with a successful signoff track record
  • Self-motivated with strong problem-solving and debugging skills
  • Ability to work effectively in a dynamic group environment

Nice to have:

  • Exposure to 2.5D/3D packaging
  • High performance and large chip design experience
  • Exposure to DFT
What we offer:
  • Comprehensive suite of benefits that supports physical
  • financial and emotional wellbeing
  • Personal and professional development programs
  • Unconditional inclusion and flexibility to manage work and personal needs

Additional Information:

Job Posted:
July 29, 2025

Employment Type:
Fulltime
Work Type:
Hybrid work
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