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ASIC Engineer, Physical Design

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Meta

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Location:
United States , Sunnyvale

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Contract Type:
Not provided

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Salary:

146000.00 - 209000.00 USD / Year

Job Description:

Meta is hiring ASIC Physical Design Engineers within our Infrastructure organization. We are looking for individuals with experience in backend implementation from Netlist to GDSII in low power and high-performance designs to build efficient System on Chip (SoC) and IP for data center applications.

Job Responsibility:

  • Develop and own physical design implementation of multi-hierarchy low-power and high-performance designs, including physical-aware logic synthesis, floorplan, place and route, clock tree synthesis, static timing analysis, IR drop, EM, and physical verification in advanced technology nodes
  • Resolve design and flow issues related to the physical design, identify potential solutions, and drive execution
  • Deliver physical design of an end-to-end IP or integration of ASIC/SoC design and point out lower power and higher performance trade-offs
  • Define and implement schemes, including semi-custom placement and routing, to improve performance and power
  • Work with the RTL design team to understand partition architecture and drive physical aspects early in the design cycle
  • Interface with the RTL design team to drive design modifications to resolve congestion/timing issues and implement functional ECO’s
  • Use EDA tool-based programming and scripting techniques to automate and improve throughput and quality
  • Interact with tool vendors to drive tool fixes and flow improvements. Perform tool evaluations of new vendor tools and functions

Requirements:

  • Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience
  • 6+ years of experience in interpersonal, teamwork, communication skills and experience interfacing with cross-functional teams, IP, and EDA vendors
  • Experience in physical design and timing closure
  • Experience with large SOC designs (>20M gates) with frequencies over 1GHZ
  • Experience in floor planning, place & route, power and clock distribution, and timing convergence of high-frequency designs
  • Experience with EDA tools like DC/Genus, Innovus/ICC2, Primetime, Redhawk/Voltus, or Calibre
  • Programming/scripting skills: TCL, Python, Perl or Shell
  • Knowledge of RTL2GDSII flow and design tape-outs in 5nm or below process technologies
  • Knowledge of geometry/process/device technology implications on physical design

Nice to have:

  • Experience in full chip floor planning, partitioning, budgeting, and power grid planning
  • Experience with low power implementation, power gating, multiple voltage rails, UPF/CPF knowledge
  • Experience in planning, implementing, and analyzing high-speed clock distribution networks. Experience with alternate strategies for clock distribution, including standard trees, mesh, H-Tree, and clock power reduction techniques
  • Knowledge of static timing analysis and concepts, defining timing constraints and exceptions, corners/voltage definitions
  • Knowledge of Circuit design, device physics, and sub-micron technology
  • Experience in the physical design of data-path intensive designs
  • Experience in the 3D-IC technology, methodology, and advanced packaging
  • Experience in validating Power Distribution Network (PDN), IR/EM, Thermals for 3D-IC
What we offer:
  • bonus
  • equity
  • benefits

Additional Information:

Job Posted:
January 23, 2026

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