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We are seeking a hands-on Applications Development Engineer with experience in electronics manufacturing, soldering, and design for manufacturability (DFM). In this role, you will work directly on next-generation process development, supporting both internal teams and external EMS partners. This includes optimizing photonic processes for PCB assembly, solder reflow, component attach, and substrate preparation, as well as creating robust workflows for scalable electronics production. You’ll collaborate cross-functionally with mechanical, electrical, and software engineers to develop and validate manufacturing solutions that meet real-world production needs.
Job Responsibility:
Develop and optimize photonic soldering and curing applications for electronic assemblies, including SMT reflow, component bonding, and interconnect formation
Conduct Design of Experiments (DOE) to refine process conditions, enhance yield, and reduce cycle times
Collaborate with manufacturing teams to translate R&D outcomes into design-for-manufacturing (DFM) ready processes and prototypes
Generate detailed technical documentation, including work instructions, process flow diagrams, and application notes
Interface with EMS customers and contract manufacturers to support pilot runs, technical evaluations, and process troubleshooting
Lead and manage internal development projects from concept to validation, including system-level testing and data-driven analysis
Maintain laboratory safety and equipment calibration
follow cleanroom and ESD best practices where required
Support prototype tool qualification and participate in continuous improvement initiatives for system performance and reliability
Participate in external technical discussions, customer demos, and onsite installation or support visits (up to 20% travel)
Requirements:
Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field
2+ years of hands-on experience in electronics manufacturing, electronics assembly, or SMT process development
Strong understanding of soldering processes, electronic component packaging, and assembly line integration
Demonstrated skills in process design, data analysis, and structured problem-solving
Excellent documentation, organizational, and project management abilities
Nice to have:
Master’s degree or equivalent experience in electronics manufacturing or process engineering
Familiarity with EMS workflows, DFM principles, and high-throughput electronics production lines
Experience with pick-and-place systems, reflow ovens, stencil printing, and optical inspection tools
Background in backend semiconductor packaging, photonic curing, or thin-film materials processing
Working knowledge of glass substrates, adhesives, and polymer materials
Prior experience supporting customer trials, joint development agreements, or field applications engineering roles
Strong verbal and written communication skills, including experience preparing customer-facing technical materials
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