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We are seeking a Cluster Thermal Engineer to help architect and deliver scalable thermal solutions for AI/HPC clusters and data center deployments. In this role, you will support the evaluation, modeling, and validation of cooling architectures for high-density platforms. You will work closely with system architects, platform engineers, and data center operations teams to ensure thermal performance, reliability, and serviceability across development and deployment environments.
Job Responsibility:
Support the thermal design of AI/HPC cluster solutions, including compute racks, cooling loops, and facility interfaces
Assist in evaluating cooling architectures (air cooling, direct liquid cooling, hybrid approaches) and identifying trade-offs in performance, cost, complexity, and reliability
Build and refine thermal and airflow models for system/cluster/data center concepts using industry tools (e.g., OpenFOAM, ANSYS, FloTHERM, or similar)
Contribute to flow-network modeling for liquid cooling and coolant distribution analyses to ensure adequate flow, pressure, and temperature margins
Help define and execute test plans to validate thermal performance at component, system, and rack/cluster levels
Support integration of cooling solutions and thermal telemetry at the cluster level in collaboration with power, networking, platform, firmware, and controls teams
Participate in design reviews with internal stakeholders and external partners/customers
summarize findings and track action items
Assist with experimental setup, instrumentation, data collection, and analysis in partnership with validation and lab teams
Create and maintain technical documentation, including requirements, design notes, modeling assumptions, test reports, and user/customer-facing summaries
Support issue triage and root-cause analysis for thermal performance and reliability concerns during bring-up and deployment
Requirements:
Strong understanding of fundamentals: thermodynamics, fluid dynamics, and heat transfer
Exposure to data center or cluster thermal concepts such as: rack/row layout considerations, CDU/coolant distribution, RDHx/AHU/fan-wall concepts, chilled water interfaces and heat rejection
Exposure to one or more thermal/CFD simulation tools (ANSYS, COMSOL, FloTHERM, OpenFOAM, or similar)
Familiarity with measurement and validation practices (instrumentation, uncertainty, sensor placement, data analysis)
Comfort working in cross-functional engineering environments and communicating technical ideas clearly
Bonus: understanding of PUE/WUE drivers, economizers/free cooling, or waste-heat reuse concepts
Bonus: coursework in heat transfer, thermodynamics, two-phase flow and heat transfer, refrigeration
Bonus: projects, internships, or research related to HPC/AI infrastructure, data centers, or high-power electronics cooling
Bachelor’s, Master’s or Ph.D. degrees in Mechanical Engineering with expertise in thermal management of electronics
Nice to have:
Understanding of PUE/WUE drivers, economizers/free cooling, or waste-heat reuse concepts
Coursework in heat transfer, thermodynamics, two-phase flow and heat transfer, refrigeration
Projects, internships, or research related to HPC/AI infrastructure, data centers, or high-power electronics cooling