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Piper Companies is looking for an Advanced Packaging Engineer - CoWoS to join a cutting-edge semiconductor organization to help drive innovation in advanced packaging technologies and integrating them into high-performance systems.
Job Responsibility:
Lead initiatives in advanced packaging technologies with a focus on system-level integration and manufacturability
Help design and layout high-density organic substrates for multi-die packages from concept to release
Be the go-to expert for bump mapping, escape routing, and layer stack-up strategies
Collaborate with cross-functional teams to align die floorplans with mechanical and system-level constraints
Collaborate with substrate vendors and OSATs (Outsourced Semiconductor Assembly and Test) to develop and implement packaging solutions
Drive the integration of CoWoS and other advanced packaging technologies into system designs
Support cross-functional teams in aligning packaging strategies with system performance and reliability goals
Requirements:
10+ years of experience leading advanced packaging technology initiatives in the semiconductor industry
Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance
Proven experience working with substrate vendors and OSATs to deliver high-performance packaging solutions
Deep understanding of CoWoS technology and system-level packaging integration
Expert in designing high-density organic substrates, including fine-pitch bump routing and complex layer stack-ups
Skilled in using design tools like Cadence Allegro APD and AutoCAD
Master's degree in Electrical Engineering, or related field required
Nice to have:
Knowledge of 3D stacking technologies is a strong plus
Background in materials science is helpful
What we offer:
Medical, Dental, Vision, 401K, PTO, Sick Leave (if required by law), and Holidays