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We are seeking an experienced and motivated engineer in the semiconductor and advanced packaging industry with expertise in analytics systems. In this role, you will translate a deep understanding of yield issues and complexities arising in heterogeneous integration into effective systems and analytics solutions. These solutions will empower our manufacturing partners to reduce variability and drive higher yields, directly impacting the success of innovative packaging technologies.
Job Responsibility:
Develop, deploy, and maintain advanced analytics frameworks and systems designed for yield analysis and variability reduction in heterogeneous integration and packaging
Work closely with manufacturing partners to identify key yield issues and deliver actionable analytics solutions
Design and implement tools and methodologies to manage and analyze advanced packaging yield data
Act as a technical liaison between manufacturing partners and internal development teams to ensure that systems are functional, efficient, and aligned with strategic goals
Collaborate with cross-functional teams to improve processes, address gaps, and enhance the robustness of advanced analytics solutions
Promote innovation by integrating cutting-edge methodologies and solutions for enhanced yield analytics
Requirements:
Bachelor's or Master's in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Software Engineering, Data Analytics, Computer Science or similar
In-depth experience with challenges and yield analysis in advanced semiconductor packaging, including 2.5D and 3D heterogeneous integration
Expertise in analytics systems, data management, and software-driven solutions
Proven track record of collaboration with manufacturing partners on yield improvement
Python programming and software engineering experience in web app development
Strong problem-solving skills and the ability to manage the complexities of heterogeneous integration
Familiarity with electronic systems and solution implementation in advanced manufacturing