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3D Physical Design Engineer

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Cerebras Systems

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Location:
United States , Sunnyvale

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Contract Type:
Not provided

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Salary:

150000.00 - 270000.00 USD / Year

Job Description:

Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. Our novel wafer-scale architecture provides the AI compute power of dozens of GPUs on a single chip, with the programming simplicity of a single device. This approach allows Cerebras to deliver industry-leading training and inference speeds and empowers machine learning users to effortlessly run large-scale ML applications, without the hassle of managing hundreds of GPUs or TPUs.

Job Responsibility:

  • Working on the design and analysis of 3D integrated products
  • Combination of traditional ASIC/SoC physical design skills, packaging, power, clock and cooling analysis
  • Work closely with the architecture and RTL team to do R&D on novel concepts for 3D integration

Requirements:

  • 10+ years of physical design/verification experience
  • Strong knowledge of block level and full-chip physical verification methodology
  • Expert at optimizing for the best power/performance and area
  • Experience with the complete physical design flow
  • Expert with ICV or Calibre tools resolving block and full-chip DRC and LVS issues
  • Expert with IR/EM analysis and resolution
  • Strong ability in scripting languages like Tcl and Python
  • Ability to make flow enhancements
  • Demonstrated ability to work with RTL teams to optimize for physical design
  • Knowledge of 2.5D or 3D packaging solutions

Nice to have:

  • Experience doing full chip floor planning and integration
  • Knowledge of clock distribution
  • Knowledge of cooling analysis
What we offer:
  • Build a breakthrough AI platform beyond the constraints of the GPU
  • Publish and open source their cutting-edge AI research
  • Work on one of the fastest AI supercomputers in the world
  • Enjoy job stability with startup vitality
  • Simple, non-corporate work culture that respects individual beliefs

Additional Information:

Job Posted:
February 17, 2026

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