Staff Design Engineer Jobs (On-site work)

Senior digital design role in Catania for an engineer with 8-12 years of EE/ECE experience. Work on advanced power management ICs, leading RTL design, verification and automation with Verilog and SystemVerilog.

Shield AI seeks a Staff Tool Design Engineer in Seattle with 7+ years in aerospace tooling. Own tooling lifecycle from concept to prove-out, design jigs and fixtures in CATIA/NX/SolidWorks, and drive production for advanced defense aircraft.

Shield AI seeks a Staff Engineer in San Diego to design and optimize next-gen autonomous UAV configurations. Requires 7+ years in aircraft design, CAD proficiency, and active Secret clearance.

Shield AI seeks a Senior Staff PCB Design Engineer in Seattle to create complex layouts for advanced aircraft. Requires 10+ years of PCB layout experience and expertise in high-speed, RF, and power electronics.

ALSO seeks a Staff Actuator Design Engineer in Palo Alto to design electromechanical actuators for light EVs. Requires 8+ years experience, motor and motion mechanism expertise. Great benefits included.

Lead SSD system design and architecture at Micron in Longmont, CO. Requires 4+ years in SSD systems, PCIe/NVMe expertise, and strong cross-functional leadership. Shape next-gen storage solutions.

Lead actuation systems architecture and design for a Group 5 UAV fighter at Shield AI in Dallas. Requires 8-15 years in aircraft actuation, EMA/EHA or hydraulic expertise, and active Secret clearance. US citizens only.

Shield AI seeks a Staff Aerostructures Design Engineer in Seattle to design high-performance structural components for next-gen autonomous UAVs. Requires 5+ years of aircraft structural design experience, CAD proficiency, and composite/metallic structures knowledge.

Renesas seeks a Staff/Senior Staff/Principal Analog Design Engineer in Bengaluru with 8-15 years of experience in analog circuit design, PMICs, and DC-DC converters. Lead complex power products from concept to market release.

Shield AI seeks a Staff Flight Sciences Engineer in Seattle to lead aerodynamic design, CFD analysis, and performance modeling for Ranger aircraft. Requires 7+ years experience and strong leadership skills.

Shield AI seeks a Staff Engineer for Aircraft Configuration Design in Seattle to develop next-gen UAVs. Requires 7+ years in aircraft design, CAD proficiency, and active Secret clearance.

Shield AI seeks a Staff Aerostructures Design Engineer in Seattle to design UAV structural components. Requires 5+ years aerospace structures experience, CAD proficiency, and composite/metallic knowledge.

Senior Staff Package Design Engineer to lead backend semiconductor manufacturing at OSATs in Bayan Lepas. Requires 10+ years in semiconductor process engineering, Lean and Six Sigma knowledge, and strong cross-functional collaboration skills.

Join Renesas in Bangkok as a Staff Package Design Engineer driving next-gen semiconductor packaging for AI, HPC and VPD markets. Requires 5-15 years in power QFN/SiP, flip-chip and leadframe development.

Renesas seeks a Senior Staff Package Design Engineer in Zhubei to develop power SiP/module, wafer-level and flip-chip packaging. Requires 10+ years in package development, strong analytical skills and GaN or power expertise.

Renesas seeks a Senior Staff Package Design Engineer in Suzhou to develop power SiP, wafer-level and flip-chip packaging. Requires 10+ years in package development, GaN and OSAT/CM experience.

Renesas seeks a Senior Staff Package Design Engineer in Kaohsiung to develop power SiP/module, wafer-level and flip-chip packaging. Requires 10+ years experience, GaN knowledge a plus.

Renesas seeks a Senior Staff Package Design Engineer in Taipei to develop power SiP/module, wafer-level and flip-chip packaging. Requires 10+ years of package development experience and strong GaN or power expertise.

Senior Staff Package Design Engineer role in Shanghai requiring 10+ years in power SiP/module, wafer level and flip-chip packaging. Lead OSAT/CM qualification, DOE process optimization and new package qualification for consumer, industrial and automotive power applications.

Lead cutting-edge semiconductor packaging innovation in Bayan Lepas. Design PowerQFN, Flip-Chip and SiP solutions for AI/HPC markets. Requires 5-15 years package development experience and engineering degree.