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Staff Design Engineer Taiwan, ZHUBEI Jobs

7 Job Offers

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)
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Renesas seeks a Senior Staff Package Design Engineer in Zhubei to develop power SiP/module, wafer-level and flip-chip packaging. Requires 10+ years in package development, strong analytical skills and GaN or power expertise.
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Location
Taiwan, Zhubei
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Salary
Not provided
renesas.com Logo
Renesas Electronics
Expiration Date
Until further notice
Staff Package Design Engineer- experienced in package development of power SiP/module
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Location
Taiwan, Zhubei
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Salary
Not provided
renesas.com Logo
Renesas Electronics
Expiration Date
Until further notice
Staff Application Engineer (experience in FPGA design/ Verilog)
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Location
Taiwan, Zhubei
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Salary
Not provided
renesas.com Logo
Renesas Electronics
Expiration Date
Until further notice
(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )
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Location
Taiwan, Zhubei
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Salary
Not provided
renesas.com Logo
Renesas Electronics
Expiration Date
Until further notice
Staff Package Design Engineer- experienced in package development of power SiP/module
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Location Icon
Location
Taiwan, Zhubei
Salary Icon
Salary
Not provided
renesas.com Logo
Renesas Electronics
Expiration Date
Until further notice
Sr. Staff Power Module Design Engineer
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Location
Taiwan, Zhubei
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Salary
Not provided
renesas.com Logo
Renesas Electronics
Expiration Date
Until further notice
Staff Digital Design Engineer
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Location
Taiwan, Zhubei
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Salary
Not provided
renesas.com Logo
Renesas Electronics
Expiration Date
Until further notice