Staff Design Engineer Taiwan, Taipei Jobs, 3 job offers

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)

Renesas seeks a Senior Staff Package Design Engineer in Taipei to develop power SiP/module, wafer-level and flip-chip packaging. Requires 10+ years of package development experience and strong GaN or power expertise.

Location

Taiwan, Taipei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Renesas seeks a Staff Package Design Engineer in Taipei to develop power SiP, wafer-level and flip-chip packaging. Requires 10+ years in package development, strong analytical skills and GaN knowledge is a plus.

Location

Taiwan, Taipei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Location

Taiwan, Taipei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

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