Staff Design Engineer Taiwan, Taichung Jobs, 2 job offers

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)

Renesas seeks a Senior Staff Package Design Engineer in Taichung to develop power SiP, wafer-level and flip-chip packaging. Requires 10+ years in package development, GaN and power module expertise, plus strong OSAT/CM collaboration skills.

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