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Staff Design Engineer Taiwan, Kaohsiung Jobs

2 Job Offers

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)
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Renesas seeks a Senior Staff Package Design Engineer in Kaohsiung to develop power SiP/module, wafer-level and flip-chip packaging. Requires 10+ years experience, GaN knowledge a plus.
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Location
Taiwan, Kaohsiung City
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Salary
Not provided
renesas.com Logo
Renesas Electronics
Expiration Date
Until further notice
(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )
Save Icon
Location Icon
Location
Taiwan, Kaohsiung City
Salary Icon
Salary
Not provided
renesas.com Logo
Renesas Electronics
Expiration Date
Until further notice