Staff Design Engineer Taiwan Jobs, 14 job offers

Staff Design Engineer Taiwan Jobs

14 Job Offers

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)

Renesas seeks a Senior Staff Package Design Engineer in Zhubei to develop power SiP/module, wafer-level and flip-chip packaging. Requires 10+ years in package development, strong analytical skills and GaN or power expertise.

Location

Taiwan, Zhubei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)

Renesas seeks a Senior Staff Package Design Engineer in Kaohsiung to develop power SiP/module, wafer-level and flip-chip packaging. Requires 10+ years experience, GaN knowledge a plus.

Location

Taiwan, Kaohsiung City

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)

Renesas seeks a Senior Staff Package Design Engineer in Taipei to develop power SiP/module, wafer-level and flip-chip packaging. Requires 10+ years of package development experience and strong GaN or power expertise.

Location

Taiwan, Taipei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)

Renesas seeks a Senior Staff Package Design Engineer in Taichung to develop power SiP, wafer-level and flip-chip packaging. Requires 10+ years in package development, GaN and power module expertise, plus strong OSAT/CM collaboration skills.

Location

Taiwan, Taichung

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Renesas seeks a Staff Package Design Engineer in Taipei to develop power SiP, wafer-level and flip-chip packaging. Requires 10+ years in package development, strong analytical skills and GaN knowledge is a plus.

Location

Taiwan, Taipei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

Staff Package Design Engineer- experienced in package development of power SiP/module

Location

Taiwan, Zhubei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

Staff Application Engineer (experience in FPGA design/ Verilog)

Location

Taiwan, Zhubei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Location

Taiwan, Taipei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Location

Taiwan, Zhubei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Location

Taiwan, Taichung

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

Staff Package Design Engineer- experienced in package development of power SiP/module

Location

Taiwan, Zhubei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

Sr. Staff Power Module Design Engineer

Location

Taiwan, Zhubei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Location

Taiwan, Kaohsiung City

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

Staff Digital Design Engineer

Location

Taiwan, Zhubei

Salary

Not provided

Renesas Electronics

Expiration Date

Until further notice

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