Packaging Design Engineer Jobs

Join AMD's Adaptive and Embedded Computing Group as a Packaging Design Engineer in Hsinchu. You will design high-performance custom ASIC packages, utilizing Cadence tools and expertise in high-speed SerDes and 2.5D/3D technologies. This key role involves collaborating across teams to define cost-...

Lead the design of complex, large-scale IC substrate packages for high-performance AI processors in San Jose. Utilize your 10+ years of expertise in high-power (>700W) delivery and high-speed (>50GHz) signal integrity. Collaborate with cross-functional teams on advanced CoWoS integration, support...

Join our team in Taichung as a Packaging Engineer specializing in Substrate Design and Layout. You will optimize die bonding and substrate layouts for ASIC and SiP solutions, including SSD controllers and NAND BGA. The role involves advanced packaging tech like FCBGA and 2.5D, using Cadence and A...