Job offers - CrawlJobs
Renesas Electronics Logo

Renesas Electronics - United States, Tempe, Engineering

3 Job Offers

Job Offers

Senior Manager, Package Design Engineering

Save Icon
Lead package technology development for AI and data center power products at Renesas in Tempe. Requires 12-15 years of semiconductor packaging experience and expertise in SiP, wafer-level, and flip-chip packaging.
Location Icon
Location
United States, Tempe
Salary Icon
Salary
Not provided
renesas.com Logo
Renesas Electronics
Expiration Date
Until further notice

Staff Package Design Engineer

Save Icon
Renesas seeks a Staff Package Design Engineer in Tempe, AZ to design advanced packages (FCBGA, SiP, WLCSP, power modules). Requires 4+ years CAD layout experience and strong OSAT/substrate collaboration skills.
Location Icon
Location
United States, Tempe
Salary Icon
Salary
Not provided
renesas.com Logo
Renesas Electronics
Expiration Date
Until further notice

Senior Staff Package Design Engineer

Save Icon
Location Icon
Location
United States, Tempe
Salary Icon
Salary
Not provided
renesas.com Logo
Renesas Electronics
Expiration Date
Until further notice