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Join Renesas in Bangkok as a Staff Package Design Engineer driving next-gen semiconductor packaging for AI, HPC and VPD markets. Requires 5-15 years in power QFN/SiP, flip-chip and leadframe development.
Lead cutting-edge semiconductor packaging development in Bangkok, focusing on PowerQFN, Flip-Chip, and SiP technologies for AI and HPC markets. Requires 5-15 years of package development experience and strong analytical skills.