Renesas Electronics - Taiwan, Taichung

Senior Product Engineer needed in Taichung to drive yield enhancement, test cost reduction, and NPI for analog/mixed-signal semiconductors. Requires 8+ years hands-on experience with ATE platforms and PMIC, DC-DC, ADC/DAC devices.

Renesas seeks a Senior Staff Package Design Engineer in Taichung to develop power SiP, wafer-level and flip-chip packaging. Requires 10+ years in package development, GaN and power module expertise, plus strong OSAT/CM collaboration skills.