Renesas Electronics - Malaysia, Batu Berendam, Manufacturing

Lead Power QFN and Cu Clip assembly process engineering in Batu Berendam. Requires 5+ years in assembly engineering, thin die and SPS solder attach expertise, plus SPC and wire bonding knowledge. Drive NPI-to-production transfers, yield and quality improvements.

Lead Power QFN and Cu Clip assembly process engineering in Batu Berendam. Requires 5+ years in assembly engineering, thin die and SPS solder attach expertise, plus SPC and wire bonding knowledge. Drive NPI-to-production transfers and yield improvements.

Lead semiconductor IC packaging and assembly engineering in Batu Berendam. Drive yield improvement, process stability, and HVM readiness for advanced power packaging (SiC, GaN, power modules). Requires 12+ years in semiconductor manufacturing and 5+ years leading technical teams.