Micron - United States, Engineering

Lead DRAM circuit design at Micron in Boise, shaping next-gen memory technology. Requires 5+ years of circuit design experience, strong analog/digital fundamentals, and SPICE simulation skills. Influence future technology nodes at scale.

Micron seeks an MTS HBM Thermal Integration Engineer in Richardson, TX to optimize thermal performance for next-gen HBM products. Requires PhD with 5+ years or Master's with 10+ years in engineering or related fields.

Join Micron's Boise expansion as a New College Grad ATE Process Engineer for Wet Etch. Requires 2+ years of process ownership experience, engineering degree, and willingness to travel internationally.

Senior FMR Engineer role in Boise, Idaho driving yield analysis and failure mode characterization for advanced packaging. Requires 3-5 years semiconductor experience, Python/SQL/JMP skills, and proven FA-to-fix loop expertise.

Senior Facilities Gas Engineer at Micron Technology in the USA. Design and maintain high-purity gas distribution systems for semiconductor manufacturing. Requires engineering degree, analytical skills, and 5+ years in semiconductor facilities preferred.

Micron seeks a New College Grad Computer Engineer in Boise to develop and optimize EDA tools and CMOS design flows. Requires a related degree, programming skills, Linux/Unix experience, and offers AI-enabled workflow innovation.

Join Micron as a Process Integration Engineer Intern for 6 months and gain hands-on DRAM technology experience. Analyze semiconductor data, drive yield improvement, and collaborate with cross-functional teams.

Join Micron Technology in Manassas, VA as a New College Grad Process Engineer supporting Diffusion, Implant, and RTP processes. Requires a Master's in engineering, 0-2 years experience, and SPC/DOE skills.

Micron seeks a Semiconductor Equipment Engineer in the US to own tool performance, reliability, and maintenance strategy. Requires an engineering degree and hands-on fab equipment experience. Salary from $82,000.

Join Micron as a Process Safety Engineer Intern in Boise, supporting PSM program development for semiconductor manufacturing. Ideal for engineering students with P&ID knowledge and process safety fundamentals.

Micron seeks an Advanced Packaging Development Engineer in Boise to develop design rules, layouts, and DRC test vehicles for TSV-based packaging. Requires 2+ years in semiconductors, EDA tools, and Python/R/MATLAB proficiency.

Join Micron as an HBM Design Engineer Intern in Richardson, USA. Work on next-gen memory solutions for AI and HPC while gaining hands-on experience with RTL design, verification, and EDA tools.