AMD - Taiwan, Hsinchu, IT - Administration

Seeking an experienced **Packaging Engineer** in **Hsinchu, Taiwan** to lead advanced semiconductor packaging for InFO, CoWoS, and Chiplet technologies. Requires 8+ years in 2.5D/3D TSV, Flip Chip BGA/LGA, and WLFO processes. Drive yield, quality, and cost improvements while managing cross-functi...

Strategic Sourcing Manager needed in Hsinchu, Taiwan to drive AMD’s Datacenter GPU test capabilities. You will manage global procurement strategies for CDU equipment, test peripherals, and RMA services, leveraging 3-5 years of electro-mechanical sourcing experience. This role demands strong suppl...

Lead External Manufacturing Operations for Backend Engineering at AMD in Hsinchu, Taiwan. Drive substrate and PCB supplier management from NPI to HVM, leveraging 20+ years of expertise in FC-BGA and advanced packaging. Collaborate cross-functionally to ensure yield attainment, issue resolution, a...

Lead a team of engineers at AMD in Hsinchu, Taiwan, driving packaging innovation for AI and computing. This role requires 15+ years in InFO, 2.5D/3D TSV, or Flip Chip BGA/LGA processes. You will own yield, quality, and cost improvements for advanced chiplet packaging. Join a culture of collaborat...

Strategic Sourcing Manager 2 role in Hsinchu, Taiwan, driving cost targets, RFX processes, and supplier performance for AMD’s semiconductor and EMS sectors. Requires 12+ years in technical/business fields or MBA with 5 years, plus expertise in Purchasing, SCM, NPI, and HVM Contract Manufacturing....