AMD - Taiwan, IT - Administration, Hybrid work

Seeking an experienced **Packaging Engineer** in **Hsinchu, Taiwan** to lead advanced semiconductor packaging for InFO, CoWoS, and Chiplet technologies. Requires 8+ years in 2.5D/3D TSV, Flip Chip BGA/LGA, and WLFO processes. Drive yield, quality, and cost improvements while managing cross-functi...

Lead a team of engineers at AMD in Hsinchu, Taiwan, driving packaging innovation for AI and computing. This role requires 15+ years in InFO, 2.5D/3D TSV, or Flip Chip BGA/LGA processes. You will own yield, quality, and cost improvements for advanced chiplet packaging. Join a culture of collaborat...

Strategic Sourcing Manager 2 role in Hsinchu, Taiwan, driving cost targets, RFX processes, and supplier performance for AMD’s semiconductor and EMS sectors. Requires 12+ years in technical/business fields or MBA with 5 years, plus expertise in Purchasing, SCM, NPI, and HVM Contract Manufacturing....