AMD - Taiwan, IT - Administration, Hybrid work

Seeking an experienced **Packaging Engineer** in **Hsinchu, Taiwan** to lead advanced semiconductor packaging for InFO, CoWoS, and Chiplet technologies. Requires 8+ years in 2.5D/3D TSV, Flip Chip BGA/LGA, and WLFO processes. Drive yield, quality, and cost improvements while managing cross-functi...